Chip Lead

**Business Line Description:**  * AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors.  **Job Summary:**  * Lead product execution for Automotive ASIL-B/D SoC’s & Data Center SOCs * Work with Systems, Marketing, PE/TE and Arch engineering to define the part. Generate and analyze data to take right and cost effective architecture decision  * Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.  * Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.  * Oversee definition management and make sure the implementation complies with the requirements  * Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed  * Work closely with Test and Product engineering teams to enable productization.  * Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.  * Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.  * Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements  * Mentor engineers across various functions  **Key Challenges:**  * Automotive SoC development pose additional challenges specific to implementation of safety mechanism  * Automotive SoC development requires ensuring very high quality and reliability, ensuring a very low ppm defectivity over an long product life time.  * The role includes leading the teams in a matrix organization, assimilating information from across functional teams and analyzing it in product context  * Understand impact of architecture on logical and physical realizability  * Working within resource and schedule constraints  **Cross functional aspects:**  * This role is primarily about leading cross functional teams  * During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors  * During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.  * Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.  * Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.  **Job Qualifications:**  * Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.   * MS in Electrical Engineering preferred (higher level education may substitute for some experience).  * Experience in leading Global cross functional teams  * Experience in leading designs in smaller geometries desired  **Job location:**   * The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home. [More information about NXP in the United States...](https://www.nxp.com/company/about-nxp/worldwide-locations/united-states:USA) NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-6692