Die Bond Process Engineer

\*\*Key Responsibilities\*\* \- Assist in establishing and maintaining the Die Bond process   \- Monitor daily production to ensure process stability, yield, and quality performance   \- Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions \- Support new product introduction (NPI), including process setup, validation, and documentation   \- Optimize process parameters to improve yield, efficiency, and reliability   \- Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)   \- Analyze data and prepare process reports   \- Participate in continuous improvement projects (e.g., cost reduction, capacity increase)   \*\*Education & Qualifications\*\* \- Bachelor’s or Master’s degree in a related field, including:     - Materials Science     - Chemical Engineering     - Mechanical Engineering     - Electrical / Electronic Engineering   \- Basic knowledge of semiconductor packaging processes is preferred   \- Strong analytical and problem-solving skills   \- Good communication skills and a team-oriented mindset   \- English proficiency: TOEIC score of 650 or above, or equivalent certification   [More information about NXP in Greater China...](https://www.nxp.com/company/about-nxp/worldwide-locations/greater-china:CHINA) #LI-2370