External Package Innovation Engineer

**Hiring: External Package Innovation Engineer** We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. **🔹** **Role Overview** As an **EPI engineer**, you will act as both a **Role Owner** and **Key Supporter** for OSAT-related development activities, ensuring robust execution from concept through production. **🔹** **Key Responsibilities** **✅** **1. Role Owner (Strategic & Governance)** * Own and lead **OSAT-wide and cross-OSAT initiatives** * Define and deploy **standard development templates and success criteria** across OSATs * Drive deployment of **Best Known Methods (BKM)** and lessons learned * Develop and maintain **technology roadmap and capability assessment** for each OSAT site * Provide **Package Innovation (PI) input** for: * External site sourcing strategy * Site selection process (jointly with interface manager) * Lead **project governance**, including: * Overall project summaries * Stoplight reporting * Regular reviews per OSAT site **✅** **2. Supporter (Execution & Project Delivery)** * Support **NPI & NTI projects** executed at external OSAT factories * Ensure OSAT compliance with: * Development processes * Required documentation/templates * Drive alignment on **SME (Subject Matter Expert) assignment** at OSAT * Support and resolve **technical and project issues** on-site and across time zones * Ensure **assembly readiness and safe production launch** **🔹** **Stakeholder Collaboration** You will work closely with cross-functional teams, including: * Project Leaders & Development Managers * Designers & Materials Engineers * Tech Integration & Modelling teams (Electrical, Mechanical, Thermal) * API and WLP/PLP/FC SMEs * OSAT partners **🔹** **What We’re Looking For** * Strong experience in **semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.** * Proven ability to manage **cross-site, cross-functional projects** * Solid understanding of **NPI/NTI development flows** * Excellent **stakeholder management and communication skills** * Ability to drive **standardization, governance, and technical problem-solving** **🌟** **Why Join Us** * Opportunity to lead **high-impact package innovation initiatives** * Work with **global teams and OSAT partners for wide exposure and fast knowledge & skill growth** * Drive **technology roadmap and next-generation packaging solutions** [More information about NXP in Malaysia...](https://www.nxp.com/company/about-nxp/worldwide-locations/malaysia:MALAYSIA) #LI-633a