Npi Process Development Engineer

•Responsible to **develop** and **qualify new LQFP** & **BGA packages** for **total assembly** processes in automotive applications. •Responsible for **quality**, **yield**, **cost** and **process improvement** activities. •Responsible for **process documentation**, **process spec**, **standard work instruction**, **OCAP**, **QIT** etc. •Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer. •Take ownership to work closely with upper management to align scope and direction of key projects. Requirements: •3-6 years of work experience with **semiconductor assembly background** for automotive customers. •Experience in **LQFP, MAPBGA**, **SiP**, **FCCSP**, **FCBGA** etc. packing development will be an added advantage. •Good technical knowledge and hands-on experience in process characterization for key processes such as **laser dicing**, **plasma dicing**, **mechanical saw**, **die bond**, **wire bonding**, **mold**, **ball attach**, **marking**, **singulation** etc. •Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success. •Good SPC, Process Control and other relevant statistical & problem-solving skills •Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage. [More information about NXP in Malaysia...](https://www.nxp.com/company/about-nxp/worldwide-locations/malaysia:MALAYSIA) #LI-633a