Pr Hv-Bcd Device Engineer

tw61 nxp semiconductors taiwan

📍 hsinchu taiwan🕐 2mo ago🔗 workday

Job Description

•**Role Purpose** –Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. •**Key Responsibilities** –Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. –Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). –Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. –Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. –Design Integration: Work within Cadence environments for layout review and test structure design. –Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. •**Required Qualifications** –Experience: Master’s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. –Technical Expertise: •Profound knowledge of Device Architecture and Device Physics. •Hands-on experience in 180nm to 55nm BCD process nodes. –Tools: •Expertise in TCAD (Sentaurus / Silvaco). •Expertise in JMP for statistical data analysis. •Proficiency in Cadence (Layout/Virtuoso). •**Preferred Qualifications (Plus)** –Advanced Power Devices: Experience with GaN, SiC, or IGBT development. –Silicon Photonics: Knowledge of Photonics integration and device physics. –Domain Knowledge: •Process Integration (PI): Understanding of mask flow and doping profiles. •Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. •**Competencies** –Accountability: Strong ownership of project milestones and outcomes. –Critical Thinking: Ability to identify root causes in complex device failures. –Interpersonal Skills: Effective communication across design and foundry teams. –Data-driven: Committed to objective decision-making through rigorous data analysis. [More information about NXP in Greater China...](https://www.nxp.com/company/about-nxp/worldwide-locations/greater-china:CHINA) #LI-7743
Pr Hv-Bcd Device Engineer at tw61 nxp semiconductors taiwan | MergeJobs