Principal Soc Chip Lead

**Responsibilities:** * **End-to-End Project Ownership**: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug. * **Technical Leadership**: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects. * **Cross-Functional Coordination**: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks. * **Program Execution & Risk Management**: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk. * **Stakeholder Management**: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews. * **Tape-Out & Silicon Readiness**: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution. **Requirements:** * Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines. * 6+ years of semiconductor industry experience. * Proven experience in SoC development from architecture through tape-out. * Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation. * Experience leading large cross-functional engineering teams. * Strong project execution, planning, and risk management skills. * Excellent communication, leadership, and stakeholder management capabilities. * Ability to influence technical direction and drive execution in a matrix organization. **Preferred Qualifications:** * Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader * Experience with automotive, industrial, or safety-critical semiconductor products. * Experience working with global development teams across multiple sites. * Successful delivery of multiple SoC tape-outs and post-silicon product ramps. **Core Competencies** * Technical Leadership * Cross-functional Collaboration * Project Execution Excellence * Risk Management * Strategic Thinking * Problem Solving & Decision Making * Stakeholder Management * Communication & Influence * Customer Focus * Results Orientation [More information about NXP in Greater China...](https://www.nxp.com/company/about-nxp/worldwide-locations/greater-china:CHINA) #LI-d6f4