Product Engineer 2 -Emx

**At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.** ----------------------------------------------------------------------------------------------------------------- Role Overview ------------- Responsible for enabling Foundry PDK teams and Foundry Design Service teams to deliver accurate, signoff‑ready on‑chip electromagnetic (EM) modeling solutions using Cadence EMX™. This role focuses on EM extraction technology enablement, foundry‑qualified modeling assumptions, and scalable reference flow development for advanced nodes, large‑scale SoCs, and complex interconnect structures. Key Responsibilities – Foundry PDK Team Support ----------------------------------------------- * Support foundry PDK teams in development, validation, and qualification of EMX technology files and EM modeling setups. * Collaborate with foundries to define EM modeling assumptions for BEOL interconnects, vias, MIM caps, inductors, and advanced process features. * Support foundry requirements on frequency‑dependent R/L/C extraction, mutual coupling, and EM accuracy correlation. * Enable EMX usage for foundry‑level qualification flows supporting SI, PI, IR‑drop, and EM signoff needs. * Work with foundry extraction and modeling teams to ensure consistency between EMX models and downstream signoff tools (Quantus, Voltus, Tempus). * Support PDK release readiness by validating EMX modeling settings against silicon data, reference designs, and correlation targets. Key Responsibilities – Foundry Design Service Team Support ---------------------------------------------------------- * Develop and maintain EMX‑based electromagnetic extraction reference flows for foundry design service teams. * Support integration of EMX extraction results into digital, analog, RF, and mixed‑signal design flows. * Provide guidance on EM extraction scope selection, solver configuration, and runtime trade‑offs for production designs. * Assist design service teams in resolving EM‑related accuracy, convergence, and performance issues. * Enable standardized, reusable EM modeling methodologies across multiple SoC and derivative design projects. * Support multi‑die, 3DIC, and advanced packaging EM modeling requirements with EMX‑based flows. **We’re doing work that matters. Help us solve what others can’t.** -------------------------------------------------------------------