Semiconductor Package Competitive Analysis Intern

**Competitive Analysis Intern – Package Innovation** ==================================================== **Role Summary** Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities. **Key Responsibilities** * Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements * Develop insights on packaging trends, cost/performance positioning, and technology differentiation * Conduct startup and emerging technology evaluations relevant to advanced packaging * Consolidate findings into clear, executive-ready reports and dashboards for PI leadership * Maintain and enhance competitive analysis databases and tracking frameworks **Additional Exposure** * Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes **Qualifications** * Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field * Strong analytical mindset with ability to synthesize large datasets into actionable insights * Proficient in Excel and PowerPoint; data analysis or visualization experience preferred * Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired * Strong communication skills with ability to clearly present findings [More information about NXP in Malaysia...](https://www.nxp.com/company/about-nxp/worldwide-locations/malaysia:MALAYSIA) #LI-633a