Senior Product Package Solution Engineer

* Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. * This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction. * Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market. * You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries. * Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external. * Translating the product requirements for New product introduction in terms of package specific spec., reliability, cost. Qualifications : * Master’s or bachelor’s degree in Material Science, Electrical Engineering. * Proactive working attitude and capable to handle new challenge. * Analytically strong, drives for results, able to deal with ambiguities. * Ambitious, energetic, result-oriented entrepreneur with a strong drive for results. * People person and team player, very strong interpersonal skills * Related field along with at least 10 years of experience in semiconductor IC packaging. * Proficient risk assessment, risk mitigation and 8D skill. * Knowledge of related package platforms such as leadframe based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging is also expected.  * Project management experience is required. * Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers. Preferred Qualifications : * Understanding of foundry process, assembly process, and failure analysis.  * PMP and Six Sigma certification is preferred. * Good coomunication in both English and Japanese languages. [More information about NXP in Japan...](https://www.nxp.com/company/about-nxp/worldwide-locations/japan:JAPAN) #LI-047f