Senior Thin Films Process Engineer

NXP’s Austin Technology and Manufacturing Center (ATMC) has an immediate opening for a Senior Thin Films Process Engineer.  ATMC is NXP’s most advanced internal 200mm high volume manufacturing wafer fab, producing  Automotive and Industrial products with our 90nm - 250nm Copper and Aluminum Process Technologies.   The position requires ownership and responsibility for process control, process development, and optimization of semiconductor processes and equipment.  This role plays a critical part in ensuring high levels of product quality,  yield and process stability in a high-volume manufacturing environment.  The ATMC Films Process Engineering group is responsible for all PVD, CVD and RTA processes within the factory. **Key Challenges**   * Develop and optimize processes for silicon semiconductors. * Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems. * Analyze metrology data to monitor material quality and drive improvements. * Reduce defectivity mechanisms and improve process control. * Participate in and/or lead cross-functional teams to exceed factory and functional area level Safety, Quality, Delivery and Cost goals. * Solve complex process and integration problems utilizing electrical, chemical and physical analysis techniques. * Lead troubleshooting and root cause analysis (8D/3x5WHY/Fishbone) for process deviations and yield issues. * Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities. * Drive equipment performance to maximize capacity and yield performance. * Improve cost performance of processes, equipment and production flows. * Demonstrate Technical Leadership through mentoring engineers and technicians to further develop the team.   **Job Qualifications**   * Education:  B.S., Masters or Ph.D degrees in Chemical, Materials Science, Mechanical or Electrical Engineering.  * Job Experience:  Greater than 10 years working in the Semiconductor Industry, within a High Volume Manufacturing wafer fab.  Less is acceptable with advanced degrees (Masters/Ph.D). * Direct experience owning PVD, CVD or RTA processes. * Hands-on experiences with Applied Materials 5500 Endura PVD, Applied Materials 5200 Centura CVD/RTA, Applied Materials Producer CVD or Novellus HDP CVD systems. * Experience with install, start-up, qualification and release to production of PVD, CVD or RTA tools. * Experience with supporting or leading New Product Introduction / New Technology Introduction Factory Level Projects. * Experience using DOEs to optimize and improve either existing or new processes. * Positive interpersonal skills, highly energetic and self-motivated. * Excellent verbal and written communication skills. * Statistical Analysis skills:  Six Sigma Green Belt or Black Belt preferred. [More information about NXP in the United States...](https://www.nxp.com/company/about-nxp/worldwide-locations/united-states:USA) NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2