Senior Wire Bond Equipment Engineer

**Key Responsibilities** * Maintain and support wire bond equipment to ensure high uptime and reliability. * Troubleshoot equipment issues and implement effective corrective actions. * Perform preventive maintenance and drive continuous equipment improvements. * Support production operations and minimize equipment downtime. * Work with Process, Production, and Quality teams to improve yield and product quality. * Lead and drive equipment qualification, sustaining , upgrade and automation projects. * Analyze equipment performance data and implement productivity improvements. * Develop and maintain maintenance procedures, work instructions, and technical documentation. * Train and mentor technicians on equipment operation and troubleshooting. **Requirements** * Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred). * Minimum 3 years of semiconductor manufacturing experience. * Strong troubleshooting and root cause analysis skills. * Familiar with SPC, FMEA, 8D, and continuous improvement methodologies. * Good communication and teamwork skills. * Able to support a fast-paced manufacturing environment. **Preferred Qualifications** * TOEIC >600 or other English comprehensive certification * Experience with wire bonder, eg K&S Rapid; ASM AERO...etc * Knowledge of automation, SECS/GEM, and equipment data analysis. * Six Sigma Green Belt or equivalent certification. [More information about NXP in Greater China...](https://www.nxp.com/company/about-nxp/worldwide-locations/greater-china:CHINA) #LI-2370